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picture1_Manufacturing Ppt 82173 | Lecture3


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File: Manufacturing Ppt 82173 | Lecture3
why model faults why model faults i o function tests inadequate for manufacturing functionality versus component and interconnect testing real defects often mechanical too numerous and often not analyzable a ...

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            Why Model Faults?
             Why Model Faults?
       I/O function tests inadequate for manufacturing 
        (functionality versus component and interconnect 
        testing)
       Real defects (often mechanical) too numerous and 
        often not analyzable
       A fault model identifies targets for testing
       A fault model makes analysis possible
       Effectiveness measurable by experiments
    Copyright 2001, Agraw    Day-1 AM Lecture 3                2
    al & Bushnell
    Some Real Defects in Chips
    Some Real Defects in Chips
             Processing defects
                     Missing contact windows
                     Parasitic transistors
                     Oxide breakdown
                      . . .
             Material defects
                     Bulk defects (cracks, crystal imperfections)
                     Surface impurities (ion migration)
                     . . .
             Time-dependent failures
                     Dielectric breakdown
                     Electromigration
                     . . .
             Packaging failures
                     Contact degradation
                     Seal leaks
                     . . . 
         Ref.: M. J. Howes and D. V. Morgan, Reliability and Degradation -
                  Semiconductor Devices and Circuits, Wiley, 1981.
      Copyright 2001, Agraw                   Day-1 AM Lecture 3                                       3
      al & Bushnell
              Observed PCB Defects
               Observed PCB Defects
       Defect classes                                      Occurrence frequency (%)
       Shorts                                                                   51
       Opens                                                                      1
       Missing components                                                         6
       Wrong components                                                         13
       Reversed components                                                        6
       Bent leads                                                                 8
       Analog specifications                                                      5
       Digital logic                                                              5
       Performance (timing)                                                       5
         Ref.: J. Bateson, In-Circuit Testing, Van Nostrand Reinhold, 1985.
      Copyright 2001, Agraw                     Day-1 AM Lecture 3                                         4
      al & Bushnell
         Common Fault Models
         Common Fault Models
       Single stuck-at faults
       Transistor open and short faults
       Memory faults
       PLA faults (stuck-at, cross-point, bridging)
       Functional faults (processors)
       Delay faults (transition, path)
       Analog faults
       For more details of fault models, see
        M. L. Bushnell and V. D. Agrawal, Essentials of Electronic 
        Testing for Digital, Memory and Mixed-Signal VLSI Circuits, 
        Springer, 2000.
    Copyright 2001, Agraw    Day-1 AM Lecture 3                5
    al & Bushnell
                     Single Stuck-at Fault
                      Single Stuck-at Fault
          Three properties define a single stuck-at fault
                       Only one line is faulty
                       The faulty line is permanently set to 0 or 1
                       The fault can be at an input or output of a gate
          Example: XOR circuit has 12 fault sites (  ) and 24 
              single stuck-at faults
                                                                                                      Faulty circuit value
                                                                                      Good circuit value
                                  c                                                    j    0(1)
                        a          d            s-a-0
                  1                                      g       h                                                 1(0)
                                                                                                                            z 
                  0                                      1        i 
                         b         e                                                         1
                                    f                                                 k 
                          Test vector for h  s-a-0 fault
        Copyright 2001, Agraw                                Day-1 AM Lecture 3                                                          6
        al & Bushnell
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...Why model faults i o function tests inadequate for manufacturing functionality versus component and interconnect testing real defects often mechanical too numerous not analyzable a fault identifies targets makes analysis possible effectiveness measurable by experiments copyright agraw day am lecture al bushnell some in chips processing missing contact windows parasitic transistors oxide breakdown material bulk cracks crystal imperfections surface impurities ion migration time dependent failures dielectric electromigration packaging degradation seal leaks ref m j howes d v morgan reliability semiconductor devices circuits wiley observed pcb defect classes occurrence frequency shorts opens components wrong reversed bent leads analog specifications digital logic performance timing bateson circuit van nostrand reinhold common models single stuck at transistor open short memory pla cross point bridging functional processors delay transition path more details of see l agrawal essentials elec...

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